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    Startseite/Applications/Artikel
    Flexible robust solder joint inspection underneath the PCB
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    Applications

    Flexible robust solder joint inspection underneath the PCB

    Today’s PCBs are not only densely populated with SMDs, but are also assembled with through-hole devices (THDs) such as connectors, capacitors, circuit
    Veröffentlicht
    12. April 2007
    Lesezeit
    1 Minute
    Rubrik
    Applications

    SMT, hall 7, booth 211

    www.viscom.com

    EPP Europe 477

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