The 100 percent 3D solder paste inspection system (SPI) SE350 is equipped with the com-pany’s calibration-free 3D sensor technology to inspect even the most demanding assemblies at 80 cm²/second inspection speeds without compromising measurement accuracy and repeatability. The sensor is an integrated assembly designed with no moving parts, eliminating machine-to-machine variation across production lines while offering the lowest cost of ownership in the industry.
Provider of reflow soldering technology, Vitronics Soltec has launched new Heavy Board options for its Centurion 1240 reflow soldering system. This
Test Research, Inc. (TRI) has announced the launch of its new 3D AXI TR7600FB SII system and emphasized that it has been designed to deliver clearer
Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting
Test Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025 at booth #2905 to show latest test and