As an additional ePaste, SN100C will now be available as a high-performance solder paste with a general purpose “P500” flux medium. Because of its high fluidity close to its melting point and fast wetting, SN100C P500 can be used as a drop-in replacement for SAC solder paste in reflow profiles that peak around 245 °C ± 5 °C. The P500 no-clean halide-free medium delivers reportedly very good printability, long stencil life, good tack, excellent reflow and wetting on all substrates with no solder balls and minimal clear residue.
Advantages of the tin-copper system include its ruggedness in impact loading and the nickel addition provides inhibition of the intermetallic growth that can increase the susceptibility of joints to failure in shock loading, e.g. when a mobile phone is dropped. These properties are prompting the industry to evaluate SN100C in flip chip and area array packages, and the company is supporting this new application by making a range of eBalls available.
While a wide range of fluxes can be used successfully in wave soldering with SN100C, Nihon Superior also is now offering eFlux, a new flux that has been specially formulated for optimum results.
A solution for the lead-free HASL Process, SN100CL features excellent fluidity — good drainage ensures no bridges even on fine-pitch circuitry, good penetration of small diameter holes, uniform coating thickness and a smooth, bright finish. SN100CL wets quickly and offers low copper erosion. SN100CL forms a stable intermetallic compound layer (Cu/Ni/Sn layer) in between solder and copper laminate.
EPP Europe 428
