DispenseJet DJ-9000, used on the Axiom platform, utilizes a non-contact method to deliver the fluid and includes process control to ensure that repeatable amounts of material are precisely deposited without touching the wafer. In laser scribing, a fluid is dispensed onto the wafer prior to scribing. The fluid deposition keeps particles and debris, which are generated by the laser, from contaminating the wafer. Laser scribing also prevents delamination which can result when 300 mm wafers are fabricated with low-K dielectric materials. When delamination occurs, it is difficult to process the wafers on traditional dicing equipment. Jetting is also a fast and easy way to deposit the fluid.
EPP Europe 426
