The company is a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets. Its innovative solder and alloy technologies are designed to meet the stringent requirements of the EV market, where thermal management, reliability, and energy efficiency are paramount. The ability to enhance thermal cycling performance and reduce energy consumption aligns with the industry’s drive towards sustainability and longer-lasting products.
At the event, the company will showcase the following products:
- Durafuse HR, a trusted and proven solder paste alloy technology, delivering enhanced thermal cycling performance (-40°C/125°C and –40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Durafuse LT, a solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys.
- Indalloy 303, or Bi+, an innovative low-temperature solder developed to meet the challenges of modern electronics manufacturing. Featuring a unique doped bismuth composition, Bi+ delivers reliability and performance for sensitive components that demand precise thermal management. It also has enhanced thermal cycling capabilities and is compatible with Indium Corporation’s low-temperature flux technologies.
- Indium12.9HF, a no-clean, halogen-free solder paste specifically formulated to accommodate fine-feature printing, as seen with 01005 and 008004 components. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes to boost SPI yields. Indium12.9HF also delivers low voiding at BGA, CSP, LGA, and QFN and high oxidation resistance without graping or solder balling on pads as small as 175 microns in air reflow.
- CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
- InFORMS, reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for increased reliability, particularly in power module applications.
The company will be exhibiting in Hall 4, at Booth D71.
