Electronic-design and CAD

The IPC-2220 PCB design series for mechanical properties of track, isolation and PTH (plated-through holes)
IPC-2223B, Sectional Design Standard for Flexible Printed Boards for flex-rigid PCBs and questions like adhesive type, placement of a flex layer into the rigid part and coverlay dimensions
IPC-7351A, Generic Requirements for Surface Mount Design and Land Pattern Standard for footprint (land) design, which is even more important than before because of lead-free processes, especially when components like CSPs (chip scale packages) and QFNs (quad flat no leads) are specified in the BOM list.
IPC-A-610E, Acceptability of Electronic Assemblies for acceptability of solder joints and assemblies
IPC-2251, Design Guide for the Packaging of High Speed Electronic Circuits and IPC-2141A, Design Guide for High-Speed Controlled Impedance Circuit Boards.With the need to comply with EU Directive 2004/108/EC, and its requirements for high EMC on all PCBs placed in the EU market, SI has become more critical. These standards assist GED designers in selecting microstrip or stripline build up for impedance.

The IPC-2220 PCB design series for mechanical properties of track, isolation and PTH (plated-through holes)
IPC-2223B, Sectional Design Standard for Flexible Printed Boards for flex-rigid PCBs and questions like adhesive type, placement of a flex layer into the rigid part and coverlay dimensions
IPC-7351A, Generic Requirements for Surface Mount Design and Land Pattern Standard for footprint (land) design, which is even more important than before because of lead-free processes, especially when components like CSPs (chip scale packages) and QFNs (quad flat no leads) are specified in the BOM list.
IPC-A-610E, Acceptability of Electronic Assemblies for acceptability of solder joints and assemblies
IPC-2251, Design Guide for the Packaging of High Speed Electronic Circuits and IPC-2141A, Design Guide for High-Speed Controlled Impedance Circuit Boards.With the need to comply with EU Directive 2004/108/EC, and its requirements for high EMC on all PCBs placed in the EU market, SI has become more critical. These standards assist GED designers in selecting microstrip or stripline build up for impedance.

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