According to the company, the new feature reduces the requirement for incremental profiling using instrumented assemblies, by delivering an instantaneous view and generated data set of the oven profile, allowing validation and documentation of oven conditions for successful reflow soldering. A broad range of calculations can be instantly captured and displayed.
“To run a traditional profile using a populated assembly can take anywhere from 15 to 30 minutes,” ECD Electronics Division Manager, Mark Waterman, explained. “While incremental product profiling is essential to overall manufacturing quality protocols, the ability to instantly validate oven readiness and alignment with Key Process Indicators (KPIs) on-demand, prior to the start of a shift or in-between product changeovers, can save considerable production time, while ensuring ongoing compliance with the originally-established ‘golden board’ process settings. Profile SnapShot is not just a chart; it is the actual oven data, viewable on-demand through ECD’s MAP software with no cumbersome imports or conversions required. Simply open the file,” Waterman added.
