ASYS, Ersa, Essemtec, Fuji, Juki, Panasonic, and Viscom are just some of the big names to have confirmed their participation as exhibitors at this year’s SMTconnect. Visitors will not only encounter products and solutions spanning the gamut of electronics manufacturing, but also a lively forum in which peers can exchange ideas as a basis for the development of key future technologies.
Future packaging production line
Other highlights include the Future Packaging production line presented by the Fraunhofer Institute for Reliability and Microintegration (Fraunhofer IZM) – this year focusing on establishing ‘competitiveness through trust, sustainable tools and the supply chain’.
The topic of supply chains will also be addressed at the ‘EMS Park’ special showcase area. Offering ‘best practice’ presentations on topics including EMS selection, this area will highlight the benefits of close collaboration between EMS providers and OEMs and provide a platform for exchanges that build trust. It will also focus on other development obstacles and supply chain optimization.
The trade fair promises an exciting forum with presentations covering everything from ‘integrating AI into electronics manufacturing lines’ to ‘promoting young talent’ and ‘women in mechanical engineering’. For more information, visit smtconnect.com.
PCIM Europe
Taking place concurrently with SMTconnect, this year’s PCIM Europe looks set to be the biggest show yet. The international event showcases current products, topics and trends in the field of power electronics.
Two months before the event, organisers confirmed that floor space had reached a historical peak of over 30,000 m². 57% of the companies exhibiting come from beyond Germany, and include industry leaders such as Fuji Electric Europe, Infineon, Mitsubishi Electric Europe, Semikron Danfoss, Wolfspeed, Nexperia, Rohm Semiconductor, Hitachi Europe and Texas Instruments Deutschland.
A conference programme of around 400 presentations will run alongside the expo – with topics ranging from silicon and wide bandgap power semiconductors to innovative packaging technologies, e-mobility to renewable energy. A poster session will be held on the final day of the conference.
The event has three stages each focusing on a different area. The E-Mobility & Energy Storage Stage will host presentations on electromobility and power electronics energy storage. The Exhibitor Stage provides a space for exhibitors to showcase their innovations. And the Industry Stage will be a platform for presentations and panels concerning the latest research and development. Agenda highlights include ‘Wide Bandgap Design with GaN HEMT and Vertical GaN’, ‘SiC is Sold Out for 2023 – Can GaN Help Me?’, as well as ‘Support for Grid Integration of E-Mobility Charging Infrastructure Using Energy Storage’.
