Metcal’s VPI-1000-XL optical inspection system handles large boards of up to 914 x 914 mm (36 x 36-in), to verify SMDs and array packages. The instrument has been designed to get in close and tight, reportedly more than any other of its kind. It features four adjustable supports to hold round, rectangular, square or L-shaped boards, and has an articulating arm carrying the optical system. The arm is the first to be capable of spanning up to 610 mm (24-in), allowing covering an area of 914 x 914 mm (36 x 36-in), without changing the lens. The optical-system mirrored tip-design can be moved through 90° left/right and 5° up/down, so that operators can inspect under array-type packages with stand-off heights as low as 0.05 mm (2 mil) and clearances of just 1.1 mm (43 mil) between parts. It can also look underneath array packages to inspect each ball and its top and bottom connections. With a quick turn of the lens adjustment ring, operators can move through the entire underside of the device for verification, such as checking on bridging, cold solder joints, open circuits, excess flux, contamination and other process-related failures. The unit can inspect all types of SMDs and other board features without changing lenses. So, no changeovers are required to inspect all elements of a board – including wire bonds, through-holes, J-legs, gull wings, leaded heel fillets, solder paste and adhesive deposits. The unit floods the underside of a component with bright white light that produces sharp and clear images on the LCD monitor. The software package allows measurement, recording, annotating, analyzing and communicating data. Images are displayed in real-time for a quick visual perception, and can be captured and stored for future reference.
EPP EUROPE 470
Productronica Hall A3/542
