“While our parent company has changed, the emphasis on delivering the most advanced and cost-effective printing solutions remains at the core of the DEK development philosophy,” says Karen Moore-Watts, Global Marketing Director for ASM’s Printing Solutions Division. “Now, with our sister Placement Solutions Division Siplace colleagues and the backing of global powerhouse ASM Pacific Technology, Ltd., we are poised to deliver transformational technologies that will enable even more efficient SMT processes. We look forward to showcasing our ongoing commitment to printing excellence during Nepcon South China.”
Over the three-day event, visitors to the ASM booth will get a first-hand look at how the company’s Horizon 03iX print platform is providing the flexibility, speed and accuracy required for modern device manufacture. Equipped with automatic material management tools APD II and Paste Roll Height Monitor, Cyclone high-speed understencil cleaning, Grid-Lok automatic board support and a host of other innovative technologies, the Horizon 03iX offers manufacturers a powerful, high-speed platform with unmatched performance. With Six-Sigma machine alignment capability of greater than 2 Cpk @ ±12.5 microns and cycle times as low as seven seconds, the Horizon 03iX unites superb accuracy with speed and flexibility. At Nepcon South China, two Horizon 03iX systems – one configured specifically for smartphone manufacturing requirements and another designed to highlight flexible printing capabilities – will be on show.
Effective printing of today’s miniaturized geometries also requires advanced stencil and understencil cleaning capabilities. The portfolio of Process Support Products has been developed to enhance print performance to maximize yield, ensure process stability, provide greater efficiency and reduce cost. Two of the company’s most recent innovations are delivering on these objectives and will be demonstrated on-demand throughout the Nepcon South China event. VectorGuard High Tension interchangeable stencil technology builds on the inherent benefits of the VectorGuard portfolio, offering 45% greater tension across the stencil, uniform, side to side tension and the elimination of “sag” that can often occur over time with mesh mounted stencils as glue bonds weaken with use. The product’s capability is ideal for today’s finer-pitched devices.
The Ultra-Fine Pitch (UFP) Eco Roll understencil cleaning fabric was also developed to address the decreasing dimensions and increased densities of modern assemblies. Unlike other understencil cleaning products, UFP Eco Rolls leverage the consistent wicking capability of hydrophilic fabric and incorporate a unique 3D structure to encourage fast and thorough cleaning of fine-pitch apertures. The result is reduced consumables costs, more efficient and effective stencil cleaning and the potential to extend print cycles between cleans for a higher throughput process.
“The DEK products on display are the result of our team’s depth of printing knowledge and focus on innovation,” says Moore-Watts in summary. “The expertise collectively embodied in the knowledge base is encapsulated in the PrintLab resource, and this will also be a key component of our display at Nepcon South China. We invite all show delegates to talk with our team, learn about our products and discover how a DEK partnership can deliver a competitive advantage.”
