- IPC-4101C, Specification for Base Materials for Rigid and Multilayer PCBs. Covers the requirements for base material that are referred to as laminate and prepreg, including base material for lead-free processes.
- IPC-840E, Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials.
- The IPC-4550 series, Specifications for ENIG (Electroless Nickel Immersion Gold), Immersion Gold and Immersion Tin.
- J-STD-003B, Solderability Tests for Printed Boards. Prescribes test methods, defect definitions and illustrations for assessing the solderability of bare board surface conductors, attachment lands and plated-through holes utilizing either tin/lead or lead-free solder alloys.
- IPC-4761, Design Guide for Protection of Printed Board Via Structures. Provides designers and manufactories with detailed information on all existing methods for protecting vias on PCB via tenting, plugging, filling and capping.
- IPC-609A, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and other Attributes.
- IPC-1601, Printed Board Handling and Storage Guidelines. This document gives guidelines for protection of bare boards from contamination, physical damage, solderability degradation and moisture uptake.
- Education of all sales and technical personal at all subsidiaries in Europe and China in IPC standards and its different classes and levels.
- Inform all customers of IPC-sponsored seminars, workshops and technical meetings on IPC standards and their place in the electronic hardware production chain. The company also hold its own customer seminars that promote IPC standards and information.
- Assurance that new and existing NCAB bare board suppliers are following IPC standards requirements via an audit procedure. All factories producing bare boards are audited regularly to ensure high quality and reliability. When approving a new factory, the company performs factory audits and bare board samples are tested in the NCAB laboratory in Sweden, with tests made against IPC-A600G and J-STD-003B for solderability.
