535–11M-3 is an ultra-low stress, lower glass transition temperature version of the 535–10M-1 UV cure adhesive. The material is designed to eliminate any “crowning” (warpage) of sliders in Head Gimbal Assemblies and can be used in other bonding applications in the Head Stack Assembly. The material also can be used for lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.
The non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. It is a low out gassing, extremely flexible, high strength epoxy adhesive that does not contain antimony. The solution is the latest addition to the company’s extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
