3D heterogeneous integration and packaging basically means the action of gathering different micro electronics objects together in order to benefit from complementary functions. Some differences in the features lead to consider two main integration families often referred to as 3D-IC (or 3D high density) and 3D-WLP (or 3D low density).
There is an unprecedented growing demand to meet the growing needs for WLP. If flip-chip wafer bumping & WLSCP are well established today, new technologies are also emerging like TSV for 3D WLP, 2.5D interposers, 3DIC or FO WLP, requiring new capabilities and additional capacities for packaging at the wafer-scale. Semicon Europa will have a specific section to review 3D perspectives and challenges as well as existing applications including design solutions.
Also, attendants will be able to learn more about most important microelectronics applications developments such as MEMS, manufacturing test solution, and advanced packaging solutions to be the key drivers in system integration of electronic devices. The EMTC 2011 (European Manufacturing Test Conference) will focus on board and systems testing as well as MEMS and SIPS, and challenges presented by the new technologies. The conference will illustrate the description of easy and successful solutions to challenges. Also, the audience will have access to stories from the manufacturing test arena. The MEMS and sensors market is beginning a new cycle today that will extend until 2014, thanks in particular to the handsets and slate tablets. MEMS markets for consumer electronics and mobile phones are growing at an accelerated rate.
The MEMS market is still small in term of revenues compared to the semiconductor industry, but it is projected to have double-digit CAGR in the next several years. The mentioned topics will also be found in the TechARENA, a presentation stage that will host this year more than 60 presentations covering other issues in the industry such as next-generation lithography, metrology, automation, and test (free to attend). Presenters include experts and representatives from major device manufacturers including Altis, Bosch, GlobalFoundries, Intel, IBM, Micron and Nokia.
