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    Cost-effective singulation of CSP and QFN
    Foto: Moe Salih / Unsplash
    Applications

    Cost-effective singulation of CSP and QFN

    Intercon's Water Jet singulation system (in Europe handled through Macrotron Process Technologies) is capable of handling very small components down to
    Veröffentlicht
    30. Oktober 2003
    Lesezeit
    1 Minute
    Rubrik
    Applications

    Intercon’s Water Jet singulation system (in Europe handled through Macrotron Process Technologies) is capable of handling very small components down to 0,5 x 0,5 mm. An extremely fine abrasive filled water jet allows precise cutting with both straight lines and curvilinear lines, with constant widths from 50 to 500 µm. The system uses proprietary beam technology with a specially generated water jet, whereby unique nozzles ensure a reliable and maintenance-free beam. Since the system operates well on low water-supply pressure, only a few bar are necessary. This allows the use in clean-room environments. Conventional dicing systems for QFNs hardly achieve a cutting speed of 20 mm/sec, while Intercon’s system cuts through the material at more than 160 mm/sec, and reduces the chipping along the saw street by over 70 % in comparison to saw singulation. Laminates and coated devices with both ductile and brittle material can be cut in a single pass. Compared to conventional equipment, the productivity increases enormously, and frequent changes of saw blades and time consuming alignments are unnecessary. Consumable costs are low, because the water is fully recyclable.

    EPP EUROPE 457

    www.ingram-macrotron.de

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