Nelson Wong, Kulicke & Soffa’s Vice President, Wire Bond Solutions Business Unit, remarked, “Customers can rely on K&S in helping meet the process challenges of copper wire bonding at advanced silicon nodes. As the global leader of the wire bond industry, K&S is committed to providing our customers with reliable, cutting-edge technology solutions that add value to their businesses. Our R&D team continues to innovate and develop new process techniques to improve portability, stability and reliability, offering our customers a cost of ownership advantage and high confidence in our products.“
Also the company announced the launch of its new ACS ProTM Capillary, for advanced copper wire bonding applications. The new ACS ProTM Capillary provides excellent bond-ability control with fine wire diameters. Using advanced material development and an innovative design, the quality and strength of both the 1st (Intermetallic Coverage) and 2nd bond are maintained over the capillary’s usable life. The ACS ProTM Capillary significantly improves design dynamics, and extends the copper process window with enhancement of process portability and response consistency. The consistent performance of the capillary eases the production fan-out process. The improved wear resistance material used for the solution also enhances workability to help drive productivity.
Nelson Wong remarked, “Kulicke & Soffa continues to leverage its strong R&D process knowledge and extensive experience in delivering copper capillaries. With ACS ProTM, customers will benefit from the excellent bond-ability control, consistent performance, while also lowering their cost of ownership. The ACS ProTM is designed to improve copper bond quality and process stability enabling process portability and response uniformity.”
