Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Technology/Artikel
    Contact abuse and ‘hot’ versus ‘cold’ switching
    Bildquelle nicht angegeben
    Technology

    Contact abuse and ‘hot’ versus ‘cold’ switching

    Graham Dale explains the issue of contact abuse and ‘hot’ & ‘cold’ switching when using reed relays, to help users maximize the reliability of their designs
    Veröffentlicht
    26. Oktober 2017
    Lesezeit
    4 Minuten
    Rubrik
    Technology

    High current or high power inrushes are the most damaging and most frequent causes of contact damage when using reed relays. They have a specific maximum amount of current, voltage, and power ratings. The power figure is the product of the voltage across the open contacts before closure and the instantaneous current that is made.

    Contact abuse

    At Pickering, we have lost count the number of times we have heard something along the lines of: “I was only switching to 5 volts at 50 milliamps on this CMOS logic board”, as the user usually disregards the current inrush into the sprinkling of decoupling capacitors and several microfarads of reservoir capacitance on that board.

    However, only relying on electronic current to limit the power supplies to protect relay contacts should not be done. Limiting electronic current takes a finite time to react and there are often decoupling capacitors on the output of a power supply. There is nothing better than limiting resistive current.

    Due to the charging of capacitive loads, inrushes also discharges capacitors, which can become a problem as the current is often only limited by the resistance of the reed switch and PC tracks. Even capacitors charged with low voltages can cause current inrushes of tens of amps and although they may only be for microseconds, they can cause damage to small reed switches.

    As voltage increases for some applications, inrushes can become an even greater issue, specifically when discharging cables after the proof testing of high voltage. The energy stored in a capacitance is equal to ½ CV2 joules, meaning it increases with the square of voltage. So when increasing from 10 volts to 1000 volts, the stored energy will increase by 10,000 times.

    If you have had a relay contact stick closed, to be free only with a slight tap, or had a longer than expected release time, it is most likely caused by a micro-weld due to a current inrush.

    ‘Hot’ versus ‘cold’ switching

    Reed relays generally have a higher carry current rating compared to their ‘hot’ switching current rating. It is usually during ‘hot’ switching where contact damage occurs, due to the resulting arc across the contacts as they open or close. A severe current overload will quickly melt the contact area causing the two surfaces to fuse together, creating a hard weld as soon as the contact closes. Less severe current inrushes will cause a milder weld or gradually build up a ‘pip’ on one contact and erode a ‘crater’ on the other, depending on the direction of current flow. These can eventually lock together. Arcs can occur when contacts open, particularly when the load is inductive. Back EMFs from inductive loads should always be limited, usually by a simple diode for DC loads or by a snubber or varistor for AC loads.

    One way to reduce or remove these issues is to use the ‘cold’ switch. This is a common technique in test instrumentation, where the current or voltage stimulus is not applied to the switch until after the relay has been operated and the contact bounce is finished. In the same way, the stimulus is removed before the contact is opened. By using this technique, there won’t be any arcing or switched current inrushes and the relay will achieve maximum life, often into billions of operations.

    When calculating the delay time between switching on the relay coil and applying the current to the switch, it is important to consider the effects of high ambient temperature, as this is likely to be encountered. The maximum operating time and bounce figures given on the data sheets are at a 25 °C ambient level. At higher temperatures, the resistance of the coil winding will increase at a rate of 0.4 % per °C, this being the coefficient of resistance of the copper coil wire. There will therefore be a corresponding fall in coil current and the level of the magnetic field that is generated to operate the reed switch. This lower drive level will increase the operating time slightly. The timing figures on Pickering data sheets are normally quite conservative, so this is unlikely to be an issue for the normal ambient specification of 85 °C. However, it is also necessary to consider any additional self-heating within the relay, due to a high carry current and the witch resistance (I-Squared-R Watts), and to allow a little more time before turning on the current through the switch.

    productronica, Booth A1.452

    www.pickeringrelay.com

    Zusammenfassung Résumé Резюме

    Graham Dale, Direktor für Forschung und Entwicklung bei Pickering Electronics, erläutert das Thema von Reed Relais, dass mit zunehmender Last und heißem Schalten an den Kontakten höhere Temperaturen entstehen, die das Kontaktmaterial verschleißen. Der Artikel soll den Nutzern von Reed Relais Tipps geben, um deren Zuverlässigkeit zu erhöhen.

    Graham Dale, le directeur de la Recherche et du Développement de Pickering Electronics, explique le thème des relais reed qui, avec l’augmentation de la charge et une commutation à chaud au niveau des contacts, crée des températures plus élevées qui épuisent le matériau de contact. L‘article fournit des conseils aux utilisateurs de relais reed pour augmenter leur fiabilité.

    Грэхэм Дейл, директор по НИОКР в компании Pickering Electronics, затрагивает тему герконовых реле, а также износа материалов контактов в результате возрастания нагрузки и срабатывания из горячего состояния. Статья содержит советы по повышению надежности герконовых реле.

    Mehr aus Technology

    Weitere aktuelle Artikel aus der Rubrik Technology.

    Alle Technology-Artikel
    IPC-J-STD-002F mandates automatic flux doctor blade for solderability testingFoto: Louis Reed / Unsplash
    Technology

    IPC-J-STD-002F mandates automatic flux doctor blade for solderability testing

    10. November 2026

    The release of IPC-J-STD-002 Revision F introduces stricter, more precisely defined requirements for solderability testing, including a mandatory automatic flux doctor blade on solderability testers. Equipment lacking…

    Plasmatreat PFW10 and PFW20 Static Plasma Jets Target Sensitive PCB Surface TreatmentFoto: Johannes Plenio / Unsplash
    Technology

    Plasmatreat PFW10 and PFW20 Static Plasma Jets Target Sensitive PCB Surface Treatment

    28. Oktober 2026

    Plasmatreat's PFW10 and PFW20 static plasma jet systems are designed for selective, high-accuracy surface treatment of sensitive electronic assemblies, including circuit boards, using cold atmospheric-pressure plasma.

    Indium Corporation to Present High-Reliability Solder Pastes at EFX 2026 in StuttgartFoto: Indium Corporation
    Technology

    Indium Corporation to Present High-Reliability Solder Pastes at EFX 2026 in Stuttgart

    30. September 2026

    Indium Corporation will exhibit three solder paste technologies at Expo for Electronics Manufacturing (EFX) 2026 in Stuttgart, Germany, addressing thermal cycling performance, low-temperature step soldering and…

    Europlacer: Software as the Core Performance Driver in High-Mix SMTFoto: Brecht Corbeel / Unsplash
    Technology

    Europlacer: Software as the Core Performance Driver in High-Mix SMT

    24. September 2026

    Europlacer makes the case that traditional SMT software was not designed for the demands of high-mix, short-run production, and that the resulting performance gap is increasingly visible on the shop floor.

    ← Zurück zu TechnologyZur Startseite