In 2005, these products spearheaded the company’s growth in the semicon sector. The company also revealed details of KLR 9100, an advanced compound for Kalrez perfluoroelastomer parts offering minimal particles for next generation chips.
The products complement the company’s “dry to wet” range of perfluoroelastomer sealing parts, and offer a sealing product for every key semicon fab process. Each is designed to withstand semiconductor process media, including reactive plasmas, at temperatures as high as 327 °C, while helping fabricators reduce particle generation and cut costly downtime in silicon wafer processing.
“Since its introduction in 2002, Kalrez Sahara 8085 has become a proven success by helping Fab lines to significantly reduce particle adders and improve equipment reliability in HDPCVD, SACVD, PECVD, tungsten CVD and etching processes,” said Martin Vaughan, marketing manager Europe – Kalrez Semiconductor Industry.
“First launched at Semicon Europa 2004, Kalrez Bonded Door Seals have already been adopted by several leading Fab lines to seal CVD, etch and ashing processes for the key 200 mm and 300 mm wafer production equipment platforms, and report significant benefits,” said Vaughan.
Kalrez Sahara 8085 Bonded Door Seals are designed for HDPCVD, PECVD, SACVD, low-K CVD and metal CVD as well as etch and ash wafer processing applications.
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