At only 2.00 mm larger than the device package, with no other external hold-downs required, this patent pending design is suitable for the development and validation of BGA and LGA devices, while offering a superior electrical performance with a very low signal attenuation of up to 2.5 GHz.
Features and benefits include different advantages: therefore, a small overall size and same footprint is given as device – only 2.00 mm larger than the device.
This socket adapter is designed for development and validation of BGA and LGA devices, production level socketing, and SMT board to board connector applications. Here are standard eutectic tin/lead solder balls or new lead-free tin/silver/copper solder ball terminals for RoHS Compliant applications. Alignment pins protect pin field and aid in hand placement with optional stand-offs available. Data sheet and signal integrity simulation data including IBIS, HSPICE, and Touchstone models are available online.
EPP EUROPE 435
