Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, has recently introduced the FOX² that combines a dispensing system of of solder paste or glue and placement in a single machine.
FOX² has a machine footprint of just 1m² and can accept PCB sizes up to 16 x 12″. Components with sizes from 01005 up to 1.3 x 3.1″ are placed. The machine achieves 10,800 cph (IPC9850) with the release of eplace 23 and still remains 50 μm accuracy, 3 sigma with a two nozzle head.
The new version is based on the original platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.
