Viscom’s AOI/AXI X7055 inspection system unifies the advantages of optical and X-ray inspections. The integrated 4M pixel imaging technology has significantly increased the throughput rate, while maintaining or improving the inspection depth. The system can be equipped with 2 orthogonal megapixel modules (4M cameras each) and, in addition, with 2 AV modules (max. 8M pixel each) for angular views. The X-ray module is available as 120 or 160 kV version. In the single-track mode, verification of large boards with dimensions of up to 20 x 24-in (500 x 610 mm) is possible, in double-track operation with board sizes of up to 200 x 280 mm. The sensor modules contribute to the requirements for greater component height. They permit an upper passage height of 35 mm and lower height of 50 mm. And PCBs with thicknesses of 0.5 to 5 mm can be transported. The X-ray exposure is considerably reduced with a shutter target, and the exposure per component/passage is automatically recorded and available for documentation. The X-ray source guarantees variation-free, highly constant beam intensity, reducing pseudo-errors to a minimum. Another characteristic is the dynamic service life determination of the cathode unit with a display for the remaining service life. The XY-unit is based on a shock-absorber table and is equipped with maintenance-free drives. A further feature is the outside machine maintenance, allowing the X-ray elements to be moved out for maintenance. Digital image units for optimum contrast are available as an option.
EPP EUROPE 433
