Blind vias are originate on an outer layer but terminate at an inner layer; buried vias exist only between inner layers and do not begin or terminate on an outer layer, so they must be drilled while layers are being added to the PCB rather than when it is finished.
Stacked microvias, compound structures, are stacked one on top of another as to achieve the highest possible routing density. Laser-drilled micro-vias reduce the space consumed by through-the-board vias. Micro-vias, having been drilled by laser, are smaller in diameter than through-vias, and because they’re smaller, more space can be devoted to circuit traces. A micro-via links only one layer of foil to the next; layers above and below these are available for foil lines, further increasing overall circuit density.
The company can fabricate stacked micro vias (HDI), boards up to 48 layers, and oversized Boards. 4 mil laser drill capability allows for ultra-fine features to be produced, Roy Akber, CEO says. “But we emphasize that we can help customers with these types of space-saving features if they come to us at the beginning of the design stage for their product,” he says. “We provide a full spectrum of engineering and design support, and can help customers find more economical ways to do certain things, such as impedance control. We have ready-to-go proven designs in house that can be immediately applied to a customer’s needs. Our goal is ultimate reliability for the customer’s products.”
