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    BGA & SMD optical inspection now for all budgets
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    Products

    BGA & SMD optical inspection now for all budgets

    For almost a decade, over 3,000 users worldwide are benefiting from the ability to inspect hidden solder joints. Whether for inspection under flip chips
    Veröffentlicht
    16. Mai 2008
    Lesezeit
    1 Minute
    Rubrik
    Products

    The Ersascope 2 goes mega pixel digital USB 2.0 and now offers 400 % more resolution! Enhanced images allow for increased clarity when zooming to high magnification especially when using the revolutionary flip chip optical head. High picture quality, increased light sensitivity and plug and play ease of use with USB 2.0 technology are the main user advantages. A new metal halide light source offers a brighter white light and a mechanical iris adapter for the additional gooseneck lighting with 2 standard fiber optic light brushes.

    SMT, booth 9-330

    NEW UK, booth D 90

    www.ersa.de

    EPP Europe 458

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