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    BGA and SMT rework system based on Focused IR technology
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    Applications

    BGA and SMT rework system based on Focused IR technology

    With the X410 PDR has developed a BGA and SMT rework system based on Focused IR technology that delivers high-end, precision results in a simple to use
    Veröffentlicht
    30. August 2007
    Lesezeit
    2 Minuten
    Rubrik
    Applications

    The system’s high quality mechanics, optics and control allow an operator to quickly and easily pick up a BGA from the nest, align it and place it onto fluxed pads. It can then be reflowed via the system’s accurate PC-based, closed-loop component and board temperature controls. Boards up to 420 x 500 mm (17” x 20”) are held securely on a macro-micro X/Y table. The table features micrometer control providing ±10 microns movement in the X and Y directions and has a macro override facility. The system delivers Focused IR component heating through an adjustable lens attachment. Its standard F700 attachment creates heating spot sizes from 25 mm to 70 mm (0.98” x 2.7”) in diameter, but there are three optional attachments available for spot sizes down to 4 mm. Underside heating is provided by two, switchable, 600 W medium wave infrared sources that make up two zones: a inner 120 mm x 300 mm (4.72” x 11.81”) and a combined 240 mm x 300 mm (9.45” x 11.81”). A vacuum operated precision component placement system delivers precise macro-micro Z-axis movement. It has micrometer control for soft component landings and allows the device to be rotated through a full 360 °. A component nest and print frame facility is also included for applying solder paste. A manually adjustable, K-type, non-contact IR sensor measures the component’s temperature in real-time throughout the process, while board temperatures are measured throughout using a manually attached K-type sensor. The entire rework process runs under PC control using ThermoActive V3 Software Suite. This package includes many functions, such as real-time, closed-loop component and board temperature control, drag and drop profile setting, temperature profiling and data logging. An optional prism-based BGA/Micro-BGA alignment system is also available, featuring split beam simultaneous alignment of the board and component. Its integral LED lighting offers controllable illumination levels and a CCTV camera supplies colour images to a 15-inch TFT/LCD flat-screen monitor.

    www.pdr.co.uk

    EPP Europe 431

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