The repair of printed circuit boards is continuously moving further into microscopic dimensions, which calls for smaller dispensed volumes of solder paste. This requires equipment that calculates with pedantic accuracy at which a fraction of a millimetre distance finely dispensed solder paste is delivered. With the Measure Dispense technology, users now have the option of accurately dispensing solder paste in rework situations even where very tightly packed uneven PCBs have to be dealt with. The product uses the integrated height sensor to establish exact distances between the relevant solder pads and the dispensing nozzle, and deposits the precise volume of solder paste. Tiny dost, down to a diameter of only 0.13 mm, can be dispensed. With Measure Dispense technology there is no need for stand off pins. In the center of dispensing, the enterprise places the continuous further development of the Advanced-Time-Pressure Method (ATP). This automatically calculates and produces the precise pressure pulse to produce the exact solder paste volume required for each dot. The aim is to achieve reproducible solder joints in environments where very high degrees of reliability are demanded.
EPP Europe 430
