The tooling for single ball repair is especially suited for solder removal, ball handling (pick & place) and soldering of a new ball. There is no other tool necessary to accomplish all rework processes. With a standard soldering profile, the complete process time for all steps (solder removal, ball pick & place, fluxing, soldering) may take less than three minutes. With motorization the system achieves a degree of reproducibility unrivalled in manual rework and minimizes operator influence. The system is capable to perform in a large field of rework applications from smallest devices up to standard BGA’s. The application package is an option to enhance the performance of the system, older systems can be retrofitted with this package. The company offers also a “Micro Rework” application package for the automated systems with optical ball inspection system to detect failure types and location.
EPP Europe 419
