Two of the most effective ways to reduce voiding in solder joints is to analyze the assembly process from a materials perspective and a reflow profiling perspective. Voiding experts from both KIC and Indium Corporation will be on hand to analyze customers’ soldering processes and recommend adjustments to help them to minimize their solder joint voiding.
The company’s no-clean pb-free solder paste, Indium8.9, avoids the void by reducing it to as low as 10 percent. Together with KIC’s reflow profiling systems, customers can reduce overall voiding and improve the reliability of their end product.
The company is a specialist in automated thermal process tools and systems for reflow, wave, curing and semiconductor thermal processes. They pioneered the development of oven profilers and process optimization tools. They also created the next generation of thermal systems to help manufacturers improve thermal process quality and reduce costs.
Indium is a materials manufacturer and supplier to the global electronics, semiconductor, thin-film and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil.
Apex, Booth 1215