“Our studies show that solder joint reliability and thermal dissipation concerns are significantly reduced with V9,” said Timothy O’Neill, AIM’s Director of Product Management. “V9 is proven to improve production yields and product quality, whether printing 0.50 area ratios or eliminating voiding on BGA and BTC packages.”
Provider of reflow soldering technology, Vitronics Soltec has launched new Heavy Board options for its Centurion 1240 reflow soldering system. This
Test Research, Inc. (TRI) has announced the launch of its new 3D AXI TR7600FB SII system and emphasized that it has been designed to deliver clearer
Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting
Test Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025 at booth #2905 to show latest test and