- Solder ball/bump – presence, pitch, offset, height, co-planarity and bridging
- Bond wire – short, broken, shift and loop height
- Chip bond – offset, height, crack and chip
- Discrete device – presence, offset, height, co-planarity and solder fillet
- Heat sink – presence, offset and height
- Under-fill – presence, fillet and height
- PCB – scratch, contamination and bridging
- Package – warpage, crack, marking, dimensions and chipping.
