Metcal’s APR-5000-XLS array-package rework system provides precise, cost-effective operation with a wide range of components, including BGA, CSP, land-grid array, microSMD, micro-lead frame (MLF) and bumped chip packages. The station handles boards of 610 x 610 mm (24.5 x 24.5-in) and up to 6.35 mm (0.25-in) thick. It employs a single reflow/placement head and a stationery board that is centered over dual-stage pre-heaters. Key to flexibility and process repeatability is an full convection accurate heating. The result is uniform temperature control not only horizontally, but also vertically, between the die and solder ball of the replaced component. With five thermocouples and closed-loop control, the station allows for careful temperature control. Closed-loop controlled parameters of time, temperature and airflow guarantee process precision, even at the higher temperatures demanded by lead-free solder. Able to replace components down to 0.51 x 0.25 mm (20 mil x 10 mil), the station employs motorized control of XYZ and theta axis (360°-rotation). The split-vision system allows operators to view the opposite corners of a component, including splitting on rectangular components. An essential feature when reworking larger fine-pitch devices. The single-head design helps achieve a consistent, tight Delta T across board and component, so the system is suited for lead-free assemblies. Thermal damage is avoided due to precisely controlled pre-heaters. Lead-free profiles can be quickly developed via the thermocouples, closed-loop control and software help. The APR-5000-XLS employs four heating zones and one cooling zone, in order to ramp-up components and rework area carefully. Calibration reportedly is easy and remains consistent from operator to operator. The software walks the user through the steps of process development.
EPP EUROPE 425
Productronica Hall A3/542
