The company also highlights its award-winning 4000Plus Bondtester Camera Assist Automation System, ideally suited for pull-and-shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages. Additionally, the X-Plane and CT options will be demonstrated. X-Plane uses a proprietary, patent applied for, tomosynthesis, or CT technique to create 2D X-ray slices in any plane of a printed circuit board assembly (PCBA) without the need to cut or destroy the board.
The XM8000 wafer metrology platform provides an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. It provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay and critical dimensions.
