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    Startseite/Applications/Artikel
    Adhesive printing, high throughput
    Foto: Umberto / Unsplash
    Applications

    Adhesive printing, high throughput

    The Speedline Technologies' MPM UltraDot glue printer is an advanced adhesive deposition system that meets the needs of high-throughput electronics
    Veröffentlicht
    14. April 2004
    Lesezeit
    1 Minute
    Rubrik
    Applications

    The Speedline Technologies’ MPM UltraDot glue printer is an advanced adhesive deposition system that meets the needs of high-throughput electronics assembly lines. Printing adhesives has become popular as circuit boards grow more densely populated and as assembly line capacity increases, and as throughput requirements accelerate, printing becomes a viable alternative. The UltraDot printer offers significant advantages over adhesive dispensing technology: delivering of up to 145,000 dots per hour, at a lower cost per dot; unlimited number of dots placed in one stroke, with cycle time not affected by the number of dots; and unlimited combinations of dot sizes and shapes. The UltraDot reportedly operates at a speed equaling the rates of chip shooters. The system is available with the Rheometric pump technology, and handles all glue printing applications and stencil types. It also can be used for solder paste printing.

    EPP EUROPE 429

    www.speedlinetech.com

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