STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, is pleased to announce the acquisition of a new Fischerscope X-ray XDAL 237, an energy dispersive X-ray fluorescence (EDXRF) system.
The Fischerscope EDXRF measuring instrument has a silicon drift detector, allowing a higher resolution for light elements; aluminum Al (13) to uranium U (92). Not only can this system non-destructively measure various plating thicknesses on printed circuit boards and/or components, it also can measure and analyze very thin coatings (1 µm), complex compositions or small concentrations.
The measurements of the plating thickness include but are not limited to the following plating stack-up combinations:
- Electroless nickel / immersion gold (ENIG)
- Gold / palladium / nickel / copper
- Immersion tin / copper
- Immersion silver / copper
- Tin-lead / copper
Mark McMeen, Vice President of Engineering Services, remarks: “This additional capability to perform non-destructive determination of the weight percentage of Pb (lead) and Sn (tin) in the plating accommodates the growing need for this type of testing. With both the SEM/EDS and the new EDXRF, STI’s Analytical Services Department can now better provide for customer demands.”
