Event highlight: productronica 2025
This November, the international electronics manufacturing community will gather in Munich for productronica 2025, the world’s leading trade fair for electronics development and production. Held every two years, the event serves as a milestone in the industry’s continuous cycle of innovation, presenting the very latest developments in automation, inspection, sustainable production, and next-generation assembly technologies. In our detailed coverage, we examine the key industry trends driving the exhibition (from page 10) and present exhibitor highlights (from page 18).
Beyond the show floor, broader forces are shaping the industry’s direction. Shifts in global politics are increasingly influencing the flow of semiconductor investment and reshaping supply chains worldwide. Our feature on page 40 explores how companies are adapting strategies to remain resilient in this new landscape.
Measuring the Gap: SiP Inspection Reimagined
As smartphones grow more powerful, their internal components move closer together — sometimes just 20 µm apart. This poses a major challenge for optical inspection. In this issue, Koh Young shows how its Meister D+ system uses coaxial lighting and high-resolution optics to measure these ultra-narrow gaps reliably, even in reflective, high-density SiP assemblies (from page 14).
With these perspectives, the issue provides an in-depth look at the forces driving change across the electronics manufacturing industry.
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