According to the company, the improvements were made to address the need for higher bandwidth and faster data rates. Reportedly, this improvement brings the electrical properties very close to typical mid Dk Df products at almost cost parity with much higher dielectric loss Phenolic cured systems. The high decomposition temperature and low thermal expansion properties of the substrate offer thermal reliability performance comparable to or beyond the firm’s lead-free compatible materials 370HR and IS410. In addition, its low loss properties, combined with its stable and predictable dielectric constant, make this product well suited for high-speed applications.
EPP Europe 415
