Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Products/Artikel
    4-in-1 automated optical inspection solution for PCB production
    Bildquelle nicht angegeben
    Products

    4-in-1 automated optical inspection solution for PCB production

    Orbotech Ltd. has introduced the Ultra Dimension Automated Optical Inspection (AOI) series that integrates four Solutions into one, for PCB production.
    Veröffentlicht
    27. Oktober 2017
    Lesezeit
    2 Minuten
    Rubrik
    Products

    Orbotech Ltd., a supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products, introduced the Ultra Dimension Automated Optical Inspection (AOI) series for PCB production. Designed to meet the rigorous demands of advanced PCB manufacturing processes, this is the first Automated Optical Inspection solution to integrate four solutions – pattern inspection, laser via inspection, Remote Multi-Image Verification and 2D metrology – into a single system. This solution enables manufacturers to increase quality and yield, as well as reduce their overall total cost of ownership (TCO), signifying a revolution in the AOI room workflow.

    The solution’s combination of high precision and high quality pattern inspection, as well as, laser via (LV) inspection in a single scan is powered by the company’s Triple Vision Technology and Magic Technology. By using varied light settings and three different types of images, not only is detection capabilities significantly improved, but there is also a reduction in inspection set-up time and false alarms. This, in turn, allows manufacturers of advanced PCBs using SLP/mSAP (substrate-like PCB/modified semi-additive process) the flexibility to inspect a variety of applications and materials, and eliminates the need to use inspection masks, which can cause defects to be overlooked.

    The 2D metrology automatically measures both top and bottom conductor widths for lines and pads of a wide variety of shapes, enabling the higher accuracy and impedance control necessary for SLP/mSAP, as well as advanced HDI applications. The Remote Multi-Image Verification (RMIV) enables the remote verification of multiple image defects, which are acquired during the inspection process. The company’s unique multi-image technology enables operators to differentiate between real and false defects, which are then sent to offline RMIV stations. Ultra Dimension with RMIV also reduces the number of verification stations required, thereby freeing up valuable floor space in the Automated Optical Inspection room and allowing manufacturers to cut their overall labor and operational costs significantly.

    www.orbotech.com

    Mehr aus Products

    Weitere aktuelle Artikel aus der Rubrik Products.

    Alle Products-Artikel
    Heavy board options added to reflow soldering system
    Products

    Heavy board options added to reflow soldering system

    27. Mai 2025

    Provider of reflow soldering technology, Vitronics Soltec has launched new Heavy Board options for its Centurion 1240 reflow soldering system. This

    New 3D AXI platform provides clearer imaging
    Products

    New 3D AXI platform provides clearer imaging

    22. Januar 2025

    Test Research, Inc. (TRI) has announced the launch of its new 3D AXI TR7600FB SII system and emphasized that it has been designed to deliver clearer

    No-clean formula maximize the solderability
    Products

    No-clean formula maximize the solderability

    10. Januar 2025

    Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting

    Extensive program of testing options
    Products

    Extensive program of testing options

    10. Januar 2025

    Test Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025 at booth #2905 to show latest test and

    ← Zurück zu ProductsZur Startseite