Mirtec today announced they will display their award-winning 3D AOI and SPI inspection systems in pb tec’s booth at the upcoming SMT Hybrid Packaging show, scheduled to take place May 16–18 at the Messe in Nuremberg, Germany.
The company is a strong presence at the show each year, and 2017 is no exception. They are planning to display several systems, including the MV-6E OMNI, MV-7OMNI, MS-11, and the Intelli-Sys Inc. Intelli-Track.
The company’s MV-6E OMNI, is unquestionably the inspection industry’s most technologically advanced AOI system in consideration. This all new MV-6E OMNI 3D in-line AOI system is configured with the company’s Omni-Vision 3D inspection System hich combines their award winning 15 Megapixel ISIS vision system with the digital multi-frequency eight projection 3D system to provide precision inspection of SMT devices on finished PCB assemblies. The company’s 15 megapixel ISIS vision system is a proprietary camera system designed and manufactured for use with our complete product range of inspection equipment. The digital multi-frequency eight-projection technology provides true 3D inspection using a total of four (4) programmable digital moiré projectors. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects, as well as, solder volume post reflow. Fully configured the new MIRTEC MV-6e OMNI machines feature four (4) 10 megapixel side-view cameras in addition to the 15 megapixel top-down camera.
The MV-7 OMNI-QHD 3D AOI machine features the next generation of the company’s award-winning OMNI-VISION 3D inspection technology in a high-performance AC Servo Drive Platform. This revolutionary technology combines our proprietary 15 MP CoaXPress Vision System with the company’s exclusive Quantum High Definition (2048 x 1536) digital multi-frequency 3D projection technology to provide unprecedented image quality, accuracy and repeatability necessary for precision inspection of SMT devices on finished PCB assemblies. This new technology will set the standard by which all other 3D inspection equipment will be measured. The MV-7 OMNI-QHD machine also features four (4) 10 megapixel side-view cameras for inspection of regions of interest which are not accessible with the 15 MP top-down camera.
The MS-11 3D in-line SPI Machine is configured with the exclusive 15 MP ISIS vision system, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. The machine uses dual projection shadow free moiré phase shift imaging technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11 uses the same robust platform as MV-7 Omni series.
The company’s total quality management system software, Intellisys will also be on display at the SMT Nuremberg show. This software suite promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies.
SMT Hybrid Packaging, Booth 4–140
