Only height depending reflected single wavelengths are in focus and pass a confocal optic system with a spectrometer. An accuracy of up to 0.5 µ can be achieved. For high speed bump inspections the Laser Triangulation System (LTS) is used. Stud bumps, solder bumps and gold bumps can all be inspected with the CCS, LTS or a combination of the two.
The intelligent software of the Falcon makes the creation of new inspection recipes easy and fast. Another big advantage is the efficient differentiation between killer defects and acceptable deviations.
As a result, the gap between overkill and underkill is very narrow and the overall wafer yield is increased. After in-depth system and application studies, the inspection results of a complex application recently convinced one of the leading European semiconductor manufacturers. A first system will soon be installed in Europe. Quasys is the distributor in Europe for Camtek´s wafer inspection systems.
EPP EUROPE 446
