Mirtec announces that the company will premier its Alpha_SIP 3D Automated Optical Inspection system at productronica 2019. New to this event, Messe München and the trade magazines EPP and EPP Europe have organized a 3D AOI Arena. Leading 3D AOI manufacturers, such as Mirtec, will demonstrate their latest 3D inspection technology at this four-day event scheduled to take place at the Munich Trade Fair Center in Munich, Germany.
The Alpha_SIP system is configured with the company’s proprietary hybrid 3D inspection technology, which provides uniform precision measurement across the entire 3D measurable range regardless of external factors such as PCB density and material characteristics. This technology yields superior edge definition and requires less software filtering of raw inspection data. The better the raw data, the better the inspection performance which is especially crucial for accurate solder joint inspection.
The automatic programming software uses Machine Learning to minimize human error and to standardize the programming process. This advanced software solution automatically analyzes the PCB architecture and assigns the appropriate part type and process parameters for each SMT device thereby maximizing programming efficiency.
The company’s Optical Character Recognition (OCR) technology reduces false calls and improves production process efficiency by automatically restoring and inspecting damaged characters through AI and Deep Learning.
“Mirtec has earned a reputation as one of the most progressive and dynamic suppliers of inspection equipment to the electronics manufacturing industry”, stated Chanwha Pak, CEO. “productronica is an event that brings together the latest 3D Automated Optical Inspection technology from every major AOI manufacturer throughout the world. We are very excited to present our technologically advanced Alpha_SIP 3D system at this year’s event and at the 3D AOI Arena as well.”
productronica, Booth A2–413, Booth A2–506