Seika Machinery, Inc. (Torrance, CA) will exhibit at SMTA International 2026, scheduled for 27–29 October at the Donald E. Stephens Convention Center in Rosemont, Illinois (Booth 2814). The company, which acts as a distributor and engineering-services provider for a range of Japanese equipment and materials manufacturers, will highlight solutions spanning PCB depanelling, solder paste characterisation, reflow optimisation, board cleaning and electromagnetic compatibility (EMC) analysis.
Central to the depanelling display is the Sayaka SAM-CT34XJ router, a platform configurable for both in-line conveyor integration and stand-alone operation. Key features include automatic fiducial recognition, QR-code-based programme loading and an optional automatic bit-changer. The manufacturer specifies a positional repeatability of ±0.01 mm, a parameter that is increasingly relevant as board layouts become denser and routing tolerances tighter. Reliable fiducial recognition is particularly important in mixed-production environments where frequent board-type changeovers are common.
On the materials-characterisation side, Seika will present the Malcom PCU-285 viscometer, positioned as the current evolution of the company's solder paste viscosity measurement line. The instrument incorporates an onboard PC with touchscreen interface, supports automated measurement cycles, local data storage and network connectivity, and maintains compliance with JIS Z3284 — the Japanese industrial standard governing thixotropic index determination and viscosity recovery analysis. Consistent viscosity measurement is a prerequisite for stable stencil-printing performance and is directly linked to first-pass yield in solder paste inspection (SPI) workflows.
Complementing the viscometry offering, the Malcom RCX profiler system will be shown as a real-time thermal profiling tool for reflow ovens. Accurate profiling data enables process engineers to verify that time-above-liquidus, peak temperature and cooling-rate parameters remain within the solder paste manufacturer's process window — a requirement that becomes more stringent as lead-free alloys with narrower thermal windows are adopted.
For post-process cleaning, the Unitech PCB cleaner on display is described as accommodating large board sizes, addressing the need for thorough flux residue removal from complex, high-density assemblies before conformal coating or functional testing.
The inspection and reliability segment of the booth will feature the Morita Tech WM7000 series EMC Noise Scanner, which visualises and maps electromagnetic emissions at the board and component level during product development and pre-compliance validation. Alongside this, Kyowa strain-gauge systems will be demonstrated for quantifying mechanical stress on PCBs and solder joints — a measurement technique used during depanelling process qualification and press-fit connector insertion studies.
SMTA International 2026 runs from 27 to 29 October at the Donald E. Stephens Convention Center, Rosemont, Illinois. Further information on Seika Machinery's exhibited product range is available directly from the company.
Quelle: SMTA – https://smta.org/news/735542/Seika-Machinery-Highlights-Smarter-PCB-Routing-Inspection-and-Process-Control-at-SMTAI.htm