Apex-2019
Reworkable edge bond adhesive enhances board level
4. Dezember 2018Zymet will feature a reworkable edgebond adhesive that is capable of enhancing the board level reliability (BLR) of low temperature solder (LTS) assembly.
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Zymet will feature a reworkable edgebond adhesive that is capable of enhancing the board level reliability (BLR) of low temperature solder (LTS) assembly.
At Apex, Zymet will show its edgebond adhesive, UA-3307-B, for enhancing board level reliability in automotive and other harsh environment applications.
Zymet has introduced UA-3307-B, an edgebond adhesive to enhance board level reliability in automotive and other harsh environment applications.
Zymet’s reworkable edgebond adhesive, UA-2605-B, has been shown to enhance the board level reliability of a large WLCSP.
Zymet’s reworkable adhesive, UA-2605-B, has been shown to enhance the board level reliability of a large WLCSP, where no failures were encountered.
Zymet has introduced a new reworkable underfill encapsulant designed to underfill Package-on-Package (POP) assemblies. Compared to earlier generation
The Zymet reworkable underfill encapsulant, CN-1531 is designed for CSP and BGA encapsulation, featuring a higher Tg (glass transition point) of 110°C for
The Zymet reworkable underfill encapsulant CN-1432 is designed for CSP and BGA packages that are normally not encapsulated. However, it has been found