Applications
Ball, wedge bonders for higher yields
30. Oktober 2003Palomar's model 5060 automatic ball bonder and 5070 wedge bonder offer large-area, deep-access wire bonding for packaging applications. They are based on
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Palomar's model 5060 automatic ball bonder and 5070 wedge bonder offer large-area, deep-access wire bonding for packaging applications. They are based on
Palomar has acquired the Fiber Automation Division of Axsys to form a photonics group. Patents and intellectual property relating to nano-positioning and
Palomar has appointed Venkat Shastri as VP of engineering. He will direct the research and development efforts in assembly systems for components. Dr.
Palomar, manufacturer of assembly equipment for broadband communication devices, offers a process development and prototyping service. This service is
Palomar, equipment specialist for wireless semiconductor devices, and March Plasma Systems, are partnering to minimize voiding in eutectic die attach.
Palomar has promoted Jeffrey M. King to VP of sales and product support. He joined Palomar in 1988 when it was part of Hughes Aircraft, and has held
Palomar has promoted Bruce W. Hueners to VP of marketing. Hueners joined Palomar in 1981 when it was part of Hughes Aircraft, where he held several
Palomar has developed in-situ ultraviolet curing on its automated precision assembly die bonding equipment. With in-situ UV curing, parts that are too
Palomar, manufacturer of high-precision assembly systems for broadband communications, has promoted Kevin Conlon as president. Since joining Palomar in