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A simple, high quality approach to sealing and bonding
5. Oktober 2011Multi-Seals, Inc. has introduced an innovative alternative to liquid adhesives for component assembly. The F05 Poly-forms are flexible pre-shaped
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Multi-Seals, Inc. has introduced an innovative alternative to liquid adhesives for component assembly. The F05 Poly-forms are flexible pre-shaped
Multi-Seals Inc. introduces a line of Uni-form epoxy preforms with low outgassing properties. Unlike many adhesives, these highly cross-linked pre-shaped
Multi-Seals, Inc. offers a solid alternative to liquid epoxy for high-volume, precision sealing. Uni-form epoxy preforms are preshaped, one-part resins
Multi-Seals Inc. has introduced Nano-forms epoxy preforms to provide precision seals on microelectronics. With preforms as small as 0.035 ” (0.89 mm)