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Minimizing voiding in SMT assembly of BTCs
16. Oktober 2023Voiding in BTCs and, more specifically, QFNs, is arguably the most critical issue in electronic assembly today. In response to this concern, Indium
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Voiding in BTCs and, more specifically, QFNs, is arguably the most critical issue in electronic assembly today. In response to this concern, Indium
Indium explains how increased automotive electrification of the chip components are trends that necessitate a focus on solder paste reliability.
Indium6.4 water-soluble solder paste’s flux chemistry minimizes voiding under QFN and BGA assemblies. A typical water-soluble solder paste has
Designed for use in both air and nitrogen reflow and halide-free atmosphere, Indium flip-chip assembly fluxes can be obtained individually or as part of a
The Indium FB-800 epoxy flux combines the properties of flux and epoxy for ribbon connector SMT applications, in addition to BGA and CSP bumping
Designed for use in both air and nitrogen reflow and halide free, Indium flip-chip bonding fluxes can be obtained individually or as part of a research
Indium has developed a lead-free assembly program, known as QuickStart, which was the result of long-standing collaborative research and development with
Solder products of all kinds and more from Indium are now available from the company's Solder Online e-commerce service. With this, a full range of