
Semiconductor-packaging
Indium Corporation to Present Fluxless Vacuum Formic Acid Reflow of Indium sTIMs at IEEE ECTC
18. August 2026Indium Corporation will present findings on indium-based solder thermal interface materials (sTIMs) at IEEE ECTC in Orlando, highlighting 86 W/mK thermal conductivity and void-minimisation via fluxless vacuum formic…


