Products
Dipping paste addresses device warpage and PoP applications
17. September 2008Almit’s LFM 48 N dipping paste is a powerful alternative to gel pastes traditionally used in BGA PoP (Package-on-Package) stacked device applications and
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Almit’s LFM 48 N dipping paste is a powerful alternative to gel pastes traditionally used in BGA PoP (Package-on-Package) stacked device applications and
The Almit LFM-48 TM HP Pb-free solder paste is a latest-generation tin-copper-silver alloy formulation reportedly exhibiting good wetting, easy
The Almit LFM TM48 lead-free solder paste and SH and SR lead-free cored wires are all based on silver, copper and tin. High consistency is ensured as a