Advanced materials solutions innovator YINCAE has announced the launch of a new underfill material: UF 158UL. The product is designed to meet the increasing demands of large format chips by offering unparalleled performance in room temperature flow, fast cure, and high reliability.
UF 158UL boasts optimal flowability, allowing it to effortlessly fill gaps as small as 10 microns, even in large 100×100 mm chips. Its unique formulation ensures rapid curing at room temperature, significantly reducing production time and energy costs. Moreover, UF 158UL exhibits high reliability and provides robust protection against thermal stress, moisture, and mechanical shock. This helps to ensure long-term device performance.
“We are thrilled to introduce UF 158UL, a game-changer in underfill technology,” the company stated. “With its exceptional flow, fast cure for increased throughput, and high reliability, UF 158UL empowers manufacturers to achieve unprecedented levels of efficiency and quality in the production of large format chips,” the company added.
UF 158UL is ideally suited for a wide range of applications, including:
- High-performance computing;
- artificial intelligence;
- automotive electronics; and
- aerospace systems.
UF 158UL is available immediately. For more information, visit: www.yincae.com
