Due to its unique properties, UF 158HA is not only a high performance underfill but also can function as solder mask with eliminating electric migration. The benefits of using UF 158HA are:
- Fully compatible with all no-clean solder paste flux reside
- Eliminating cleaning process and its pollution
- Large cost saving
- Pass 5×260 ºC without any deformation of solder joint
- Better than all competitors’ underfill with cleaning process
- Be able to flow into 20m gap
- Withstand high temperature up to 400 ºC.
This material can be used for BGA, flip chip, wafer-level chip scale package application. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and friendly environment where process speed, mechanical shock and reliability are key concerns.
