One focus is on the ongoing miniaturisation of electronics. Ever smaller designs make it possible to penetrate new, previously unexplored areas. Miniaturisation requires new processes and equipment to be able to process such complex components.
The printing systems X5 Professional Optilign and X5 Professional Optilign MultiCarrier has been designed to achieve highest flexibility, superior throughput, and yields. With its patented Optilign multi substrate alignment we are able to process small, complex, odd shaped designed substrates or the solution for SiP (system in package) modules.
The patented Optilign combines the precision of optical alignment and maximum available print format to gain ideal throughput. As cleaning cycle are print stroke depended, the number of wipes is reduced dramatical as well. As per every wipe an N-Number of substrates been processed before. A clear advantage compared to single substrate processing as know whereas you clean on a very narrow cycle. Depending on substrate size the X5 Professional can manage up to 50 individual pieces within one workholder.
Another way to use Optilign is Optlign Multi Carrier. Multi Carrier has been developed to boost throughput once more when manufacturing is limited to a certain carrier / workholder size. The X5Professional Optilign Multicarrier is able to collect as many substrates as can ideally be handled with the maximum print area of the system. Means customer do not need to invest into newer enlarged carriers and adapt other production equipment because of getting more printed substrates. X5Professional Multi Carrier collects, prints and delivers afterwards carrier by carrier back to the downstream.
This innovative solution increase throughput by almost 3 times!
