Viscom announced plans to exhibit at the 2018 IPC Apex Expo, scheduled to take place Feb. 27 – March 1, 2018 at the San Diego Convention Center. Constantly at the forefront of innovation for AOI, AXI and SPI, the company will show its X8011-II and X7056-II 3D X-ray inspection systems, along with the S3088 ultra gold, S3088 ultra chrome and S3088 SPI.
In modern SMD production, components such as BGAs, QFNs or QFPs are gaining ground. Because their connectors are mostly hidden, many solder joints can only be reliably checked with an X-ray inspection. The X8011-II PCB high resolution system was developed especially for these tasks. Typical applications are, for example, the inspection of electronic assemblies and components, quality assurance in power electronics, or non-destructive special inspections.
The X7056-II automatic 3D X-ray inspection system features high throughput and image quality for the requirements in high-end electronics production. This AXI in-line system can ensure precise inspection of hidden solder joints and components in high-volume production. It is equipped with the xFastFlow transport module, which cuts printed circuit board changing times. With this feature, up to three boards can be processed at the same time. The handling design also means that significantly larger board sizes can be inspected and the scope of angled radiation is extended.
The S3088 ultra chrome addresses the growing demand for reliable and easy-to-use 3D AOI technology at an economical price. One orthogonal and eight angled view cameras provide full 3D defect detection coverage for components and solder joints on PCBs. The orthogonal optical resolution is switchable between 20 and 10 µm/pixel and also ready-made to inspect small components.
The central innovation on the S3088 ultra gold is the 3D camera module XMplus with more than 120 megapixels. This was designed for one purpose: high performance. The image data rate is up to 3.6 gigapixels per second.
The S3088 SPI inspection system combines the advantages the company’s AOI systems with 3D SPI sensor technology and inspects the solder paste deposits with the highest possible speed and precision. Even the most demanding assemblies with CSPs or micro BGAs and pad sizes of 01005 are reliably inspected.
Apex, Booth 1508
