V.J. Electronix’ X-ray inspection system VJ-3000 is engineered meeting the requirements of failure analysis of high-density board assemblies. The instrument combines analysis capabilities with acquisition/inspection technology and a board handling system with SMEMA-compatible in/out ports. Therefore, it’s offering higher throughput than manual or semi-automated operated systems, and it provides a range of examinations, detecting conflicts before a possible defect can have greater impact on the shop floor. The machine is suited for high throughput of medium and high-value production lines. The implemented ADR software technology eliminates the need for manual adjustments of contrast and brightness for different regions of images, leading to higher quality and decreasing inspection time. Nexus software provides image analysis of ball-grid array, wire sweep and void measurement in die attach.
